|Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance.
Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses:
Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips. [606 Pages, Hardcover]
Position available in team responsible for journals such as Advanced Materials and Macromolecular Rapid Communications.
Further developed multi-stage Root pumps “A 100 L SE” (ES: Energy saving) characterized by compact dimensions and high pumping speed. It cuts energy consumption by up to 50 % in comparision to the standard model “A 100 L”. The new pump rounds off the energy-saving product family of medium duty process pumps in the “A3P” series and the harsh duty process pumps in the “A3H” series.
An online guide from Professors Karen Cheng and Marco Rolandi of the University of Washington.
Particle is an international, peer-reviewed, interdisciplinary journal, focusing on all aspects of particle research. Open for submissions now!