Pixelligent and ORNL to collaborate on roll-to-roll fabrication

Joint project aims to optimize materials and formulations for improved performance and cost for roll-to-roll manufacturing, including for OLED devices.

Microchips that keep their cool up to 300 degrees C

Keeping their cool at 300 °C: the especially compact microchips of Fraunhofer IMS. Image copyright Fraunhofer IMS.

Researchers have fabricated compact SOI CMOS microchips that perform at temperatures the current generation of electronics can’t handle.

Solvay acquires Plextronics to improve OLED offerings

Expansion also includes new electronics lab in Seoul, South Korean.

Europewide challenge to Moore’s law begins

3d-stacked-hybrid-sram-cell

New pan-european research projects aims to extend Moore’s law by reducing costs and improve the energy efficiency of electronic devices.

Research consortium on organic photovoltaics

Research Consortium on Organic Photovoltaics

The chemical and pharmaceutical company Merck leads the research project POPUP designed to help achieve the breakthrough of organic photovoltaics.

Laser bonding improves automotive electronics

Laser-welded copper ribbon bond. Image copyright Fraunhofer ILT, Aachen.

Industry and research join forces to improve bonding processes in the automotive industry.

Miniaturization by dint of a novel etching process

Miniaturization of printed circuit board_oxijet-anlage

The Germany company Akon revolutionized the entire electronics industry with a precise and environment friendly etching technology.

Revolutionary 3D displays

Revolutionary 3D displays

A new development pledges to revolutionize the fittings of future car interiors – 3D displays with homogeneous, fully customizable surfaces.

Dow Corning now a member of imec

Company will cooperate with imec to fabricate 3D integrated nanoelectronics.

CEA-Leti and EV group will jointly research wafer bonding technologies

Projects target more efficient 3D TSV integration and covalent bonding at room temperature.