The Germany company Akon revolutionized the entire electronics industry with a precise and environment friendly etching technology.
Company will cooperate with imec to fabricate 3D integrated nanoelectronics.
Projects target more efficient 3D TSV integration and covalent bonding at room temperature.
Project will evaluate and implement Alchimer’s wet deposition processes for 300mm high-volume manufacturing.
Agreement covers a multi-faceted, three-phase project over the next six years for producing CIGS technology.
Technique developed several years ago at NIST for improving optical microscopes could be applied to the next generation of computer chip circuit components.