New pan-european research projects aims to extend Moore’s law by reducing costs and improve the energy efficiency of electronic devices.
Company will cooperate with imec to fabricate 3D integrated nanoelectronics.
Projects target more efficient 3D TSV integration and covalent bonding at room temperature.
Project will evaluate and implement Alchimer’s wet deposition processes for 300mm high-volume manufacturing.
Agreement covers a multi-faceted, three-phase project over the next six years for producing CIGS technology.