The week in research: February 5th 2014

A roundup of the latest materials science research from the past week.

Laser diodes versus LEDs

lpor201300048-Abstract fig

Blue laser diodes operated in stimulated emission offer a potential alternative to traditional solid-state lighting based on light-emitting diodes.

PDFLink to the original paper on Wiley Online Library

Laser as Sniffer Dog for Explosives

lpor201300072-Abstract fig

A new compact sensor system based on an LED pumped polymer laser detects explosive vapors quickly and sensitively.

PDFLink to the original paper on Wiley Online Library

Washington spinoff could make cheaper, greener LEDs

Researchers use a black light to show the photo-luminescence of their silicon nanoparticles. Image: Mary Levin, UW.

Researchers at the University of Washington have created a material to make LED bulbs cheaper and greener to manufacture, driving down the price.

Cause of LED “droop” identified

LED emitting light under forward bias in an ultra high vacuum chamber allowing simultaneous electron emission energy. Ecole Polytechnique, Ph. Lavialle.

Researchers at UC Santa Barbara and École Polytechnique confirm that Auger recombination theory is responsible for LED droop phenomenon.

PDFLink to the original paper

Zinc oxide can be used for UV lasers, LEDs

Researchers have solved a long-standing materials science problem, making it possible to create new semiconductor devices using zinc oxide.

PDFLink to the original paper

Multicolor, silicon-based LEDs without heavy metals

Liquid-processed SiLEDs: by changing the size of the silicon nanocrystals, color of the light emitted can be varied. Image: F. Maier-Flaig, KIT/LTI.

Scientists of KIT and the University of Toronto have succeeded in manufacturing silicon-based light-emitting diodes.

PDFLink to the original paper

New material for fabrication of warm-white LEDs

Discovery could bring widespread use of LEDs to homes and businesses.

PDFLink to the original paper

Copper, gold and tin for efficient chips

This photo shows an employee at the MST Lab & Fab, where the post processing of chips takes place. Image: Fraunhofer IMS

New galvanisation process from Fraunhofer Institute for Microelectronic Circuits and Systems IMS offers promise of better LEDs.

KLA-Tencor Introduces Next-Generation LED Patterned Wafer Inspection Tool

ICOS WI-2280 designed specifically for defect inspection and 2D metrology for LED applications.